발행물
컨퍼런스
Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems
1970
,
Deep Reinforcement Learning-based Interconnection Design for 3D X-Point Array Structure Considering Signal Integrity
Proceedings of the IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization
Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling
A Novel Through Mold Plate (TMP) for Signal and Thermal Integrity Improvement of High Bandwidth Memory (HBM)
Proceedings of the 2020 IEEE Electrical Performance of Electronic Packaging and Systems
Reinforcement Learning-based Auto-router considering Signal Integrity
Design, Simulation and Measurement of a Flexible Voltage-controlled Oscillator (VCO) Chip with Bending Radius