발행물
컨퍼런스
Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems
1970
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Deep Reinforcement Learning-based Through Silicon Via (TSV) Array Design Optimization Method considering Crosstalk
Design and Analysis of Thermal Transmission Line based Embedded cooling Structures for High Bandwidth Memory Module and 2.5D/3D Ics
Deep Neural Network-based Lumped Circuit Modeling using Impedance Curve
Signal Integrity Analysis of Automotive CAN-FD Networks with Series Damping Resistor-Equipped Joint Connectors
Design and Measurement of a HDMI 2.1 Connector for 8K TV considering Signal Integrity