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Proceedings of the 2022 DesignCon
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Thermal Transmission Line: Smoothing Thermal Gradients and Lowering Temperature for Signal Integrity Improvement of HBM and 2.5D ICs
Imitate Expert Policy and Learn Beyond: A Practical PDN Optimizer by Imitation Learning
A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects
Proceedings of the 2021 Conference on Neural Information Processing Systiems
Learning Collarative Policies to Solve NP-hard Routing Problems
Proceedings of the 2021 IEEE Electrical Design of Advanced Packaging and Systems
Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)