발행물
컨퍼런스
Proceedings of the The 20th International SoC Conference
1970
,
Multi-Stripline Redistribution Layer Interposer Channel Design for High Bandwidth Memory Module Considering Via Interconnect
Proceedings of the 2023 IEEE Electrical Performance of Electronic Packaging and Systems
Adaptive Gramian-Angular-Field Segmentation Integration Based Generative Adversarial Network (AGSI-GAN) for Eye Diagram Estimation of High Bandwidth Memory (HBM) Interposer
Signal Integrity Design and Analysis of Redistribution Layer Interposer Channel with Diagonal Meshed Ground in Memory Interface of High Bandwidth Memory
Modeling and Analysis of Simultaneous Switching Noise for Full Wafer Scale Chip Core
Crosstalk Mitigated On-chip Interconnect Design for High-speed Network-on-Chip (NoC) of Full Wafer Scale Chip (FWSC)