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Proceedings of the 2023 IEEE Electrical Design of Advanced Packaging and Systems
1970
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Signal Integrity Design and Analysis of Universal Chiplet Interconnect Express (UCIe) Channel in Silicon Interposer for Advanced Package
Thermal Analysis of High Bandwidth Memory (HBM) -GPU Module considering Power Consumption
The Significance of Thermal-Aware Universal Chiplet Interconnect Express (UCIe) Interface Design in 2.5D/3D ICs
Proceedings of the IEEE International Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity
SI/PI Co-Design of 12.8 Gbps HBM I/O Interface using Bayesian Optimization for PSIJ Reduction
Power Supply Induced Jitter (PSIJ) Modeling, Analysis, and Optimization of High Bandwidth Memory (HBM) I/O Interface