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Proceedings of the 2024 IEEE Electrical Design of Advanced Packaging and Systems
1970
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Design and Analysis of Ultra High Bandwidth (UHB) Interconnection-based GPU-Ring for the AI Superchip Module
Design and Analysis of L3 Cache Embedded GPU-High Bandwidth Memory Architecture with Reduced Energy and Latency for AI Computing
Design and Analysis of Extended Scale Cache (ESC) Stacked-GPU-HBM Module Architecture Considering Power Integrity (PI)
Signal Integrity Analysis of PCIe Channel with Floating Board-to-Board Connectors in Automotive Infotainment System
Explainable Reinforcement Learning(XRL)-based Decap Placement Optimization for High-Bandwidth Memory (HBM)