발행물
컨퍼런스
Proceedings of the 2025 DesignCon
1970
,
A Novel ThermoFlow Uniformizer applied Immersion Cooling System (TFU-ICS) for Highly-dense Multi-GPU-HBM based Compute Module for AI Supercomputer
PSIJ based Integrated Power Integrity Design for HBM using Reinforcement Learning: Beyond the Target Impedance
Proceedings of the 2024 IEEE Electrical Design of Advanced Packaging and Systems
Design and Analysis of High-Density Silicon Interposer Channel and Power Distribution Network
High-speed Interconnect Design of Silicon Interposer based Heterogeneous Integration for AI Computing
Eye-Diagram Edge Estimation (EEE) Network for Through Silicon Via Design in Next-Generation High Bandwidth Memory