발행물

전체 논문

280

1

Solderable 고분자 복합 소재의 환원제 함유량이 저융점 합금 입자의 융합 및 젖음 거동에 미치는 영향
임병승, 이정일, 김종민
대한용접접합학회지, 201902

2

열초음파를 이용한 ACF COB(Chip-on-Board)접합 프로세스
송용, 임병승, 정진식, 김종민
대한용접접합학회지, 201102

3

High density stacking process and reliability of electronic packaging
Y. E. Shin, J. M. Kim, Y. T. Kim, J. S. Kim
J. of KWS, 2006.04

4

Evaluation of pull strengths and fracture modes of solder joints by modified ball pull testing with protrusion jaw
H. I. Kim, S. W. Han, J. M. Kim, M. K. Choi, Y. E. Shin
J. of KWS, 2005.08

5

Research for the micro packaging of diamond electron emitter
S. M. Lee, J. M. Kim
J. of KWS, 2005.04

6

Electrically conductive adhesive bonding technology for microsystems packaging
J. M. Kim, S. M. Lee, Y. E. Shin
J. of KWS, 2005.04

7

The thermal fatigue analysis and life evaluation of solder joint for flip chip package using darveaux model
Y. E. Shin, Y. S. Kim, J. M. Kim, M. G. Choi
J. of KWS, 2004.12

8

Thermal fatigue characteristics of μ****BGA solder joints with underfill
Y. W. Koh, J. M. Kim, J. H. Lee, Y. E. Shin
J. of KWS, 2003.08

9

Prediction of thermal fatigue life on μ****BGA solder joint using Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-3.5Ag-3.0In-0.5Bi solder alloys
Y. S. Kim, H. I. Kim, Y. E. Shin, J. M. Kim
J. of KWS, 2003.06

10

Trends of electronic packaging and characteristics evaluation by shape of solder joints
Y. E. Shin, Y. W. Koh, J. M. Kim, J. K. Yoon
J. of KWS, 2002.06