Radio-Frequency Interference Estimation Using Equivalent Dipole-Moment Models and Decomposition Method Based on Reciprocity
Jingnan Pan, Hanfeng Wang, Xu Gao, Chulsoon Hwang, Eakhwan Song, Harkbyeong Park, Jun Fan
IEEE Transactions on Electromagnetic Compatibility, 2016.02
12
Placement Optimization of Integrated Circuits for Reduced Radio-Frequency Interferences in Mobile Devices
Eakhwan Song, Hark-Byeong Park, Chulsoon Hwang, Hyun Ho Park
Microwave and Optical Technology Letters, 2016
13
A High-Sensitivity Electric Probe Based on Board-Level Edge Plating and LC Resonance
Eakhwan Song, Hyun Ho Park
IEEE Microwave and Wireless Components Letters, 2014.12
14
An Evaluation Method for Radiated Emissions of Components and Modules in Mobile Devices
Eakhwan Song, Hark-Byeong Park, Hyun Ho Park
IEEE Transactions on Electromagnetic Compatibility, 2014.09
15
Shield Can Mounting Clip Design for Robust and Enhanced Shielding Effectiveness in Mobile Devices
Eakhwan Song, Hyun Ho Park
Electronics Letters, 2014.02
16
A Component-Level Radio-Frequency Interference Evaluation Method for Mobile Devices
Eakhwan Song, Hyun Ho Park
IEEE Transactions on Electromagnetic Compatibility, 2013.12
17
A Magnetic-Field Resonant Probe With Enhanced Sensitivity for RF Interference Applications
Hao-Hsiang Chuang, Guang-Hua Li, Eakhwan Song, Hyun Ho Park, Hyun-Tae Jang, Hark Byeong Park, Yao-Jiang Zhao, David Pommerenke, Tzong-Lin Wu, Jun Fan
IEEE Transactions on Electromagnetic Compatibility, 2013.12
18
An Effective and Efficient Approach for Radiated Emission Prediction Based on Amplitude-Only Near-Field Measurements
Wei-Jiang Zhao, Bin-Fang Wang, En-Xiao Liu, Hark Byeong Park, Hyun Ho Park, Eakhwan Song, Er-Ping Li
IEEE Transactions on Electromagnetic Compatibility, 2012.10
19
Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects
Jeonghyeon Cho, Eakhwan Song, Heegon Kim, Seungyoung Ahn, Jun So Pak, Jiseong Kim, Joungho Kim
IEEE Transactions on Electromagnetic Compatibility, 2011.08
20
Modeling and Analysis of Through Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Jonghyun Cho, Eakhwan Song, Kihyun Yoon, Jun So Pak, Joohee Kim, Woojin Lee, Taigon Song, Kiyeong Kim, Junho Lee, Kunwoo Park, Seun-Taek Yang, Min-Suk Suh, Kwang-Yoo Byun, Joungho Kim
IEEE Transactions on Components, Packaging, and Manufacturing Technology, 2011.03