Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
Cho, J (Cho, Jonghyun), Song, E (Song, Eakhwan), Yoon, K (Yoon, Kihyun), Pak, JS (Pak, Jun So), Kim, J (Kim, Joohee), Lee, W (Lee, Woojin), Song, T (Song, Taigon), Kim, K (Kim, Kiyeong), Lee, J (Lee, Junho), Lee, H (Lee, Hyungdong), Park, K (Park, Kunwoo), Yang, S (Yang, Seungtaek), Suh, M (Suh, Minsuk), Byun, K (Byun, Kwangyoo), Kim, J (Kim, Joungho)...More..
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 201102