발행물

전체 논문

138

11

Selection of Ferrite Depending on Permeability and Weight to Enhance Power Transfer Efficiency in Low-Power Wireless Power Transfer Systems
Ahn, Seungyoung, Rhee, Jaewon, Woo, Seongho, Lee, Changmin
ENERGIES, 202408

12

Design and Analysis of LCC-S Wireless Power Transfer Systems Considering Load-Dependent Leakage Magnetic Field
Ahn, Seungyoung, Woo, Seongho, Shin, Yujun, Lee, Changmin, Moon, Jungick, Kim, Hyun Woong, Kim, Hongseok, Huh, Sungryul
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202406

13

Methodology for Extracting Low-Frequency Input Impedance of Personal Computer During Operation Using Dual Current Probes Method
Ahn, Seungyoung, Kim, Hyunwoong, Rhee, Jaewon, Chu, Kwanguk
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 202404

14

Maximizing Output Power Using a Magnetic Energy Harvesting System Considering the Relationship Between Harvesting Time and Induced Voltage Due to a Change of Airgap
Ahn, Seungyoung, Huh, Sungryul, Koo, Ja-Il, Jeong, Okhyun
IEEE ACCESS, 2024

15

A Reduction Method of Phantom Shell Effects for APD Extraction Using Negative Permittivity Material
Ahn, Seungyoung, Lee, Changmin, Rhee, Jaewon, Kwon, Hyukchoon, Park, Yongho
IEEE ACCESS, 2024

16

A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component
Ahn, Seungyoung, Lee, Sanguk, Kim, Hyunwoong, Ahn, Jangyong, Rhee, Jaewon, Cho, Jaeyong, Kim, Hongseok
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2024

17

Signal Integrity Analysis of Through-Silicon-Via (TSV) with Passive Equalizer to Separate Return Path and Mitigate the Inter-Symbol Interference (ISI) for Next Generation High Bandwidth Memory
Kim, HyunWoong, Park, Jongcheol, Lee, Sanguk, Kim, Jongwook, Ahn, Seungyoung
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202312

18

Determination of Compensation Capacitor Considering the Dead-Time Characteristics for ZVS in Wireless Power Transfer System
Kim, H[Kim, Haerim], Kim, J[Kim, Jongwook], Ahn, J[Ahn, Jangyong], Shin, Y[Shin, Yujun], Park, B[Park, Bumjin], Huh, S[Huh, Sungryul], Choi, S[Choi, Semin], Park, J[Park, Jaehyoung], Ahn, S[Ahn, Seungyoung]
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 202306

19

Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface
Kim, H[Kim, Hyunwoong], Lee, S[Lee, Seonghi], Park, J[Park, Jongcheol], Shin, Y[Shin, Yujun], Woo, Seongho, Kim, J[Kim, Jongwook], Cho, J[Cho, Jaeyong], Ahn, S[Ahn, Seungyoung]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 202305

20

A 5.9 GHz Channel Characterization at Railroad Crossings for Train-to-Infrastructure (T2I) Communications
Choi, J[Choi, Junsung], Ahn, S[Ahn, Seungyoung]
ELECTRONICS, 202305