발행물
컨퍼런스
The 7th International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE 2022)
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Polymer/Cu hybrid CMP process for high-reliability of Cu direct bonding
Effect of Redox Additive on Synaptic Characteristics of Organic Electrochemical Transistors
Second-order Flexible Mott neuron
Au Nanoparticle Inserted Sandwich Structure Charge Trap Memristor for Low Power and High Speed Neuromorphic Synapse Application
Development of next-generation CPI bonding materials and processes through advanced NCFs system