Development of n-type Ti2CoNiSb2 double half-Heusler compound by the breaking of valence-balanced rule and achieving high thermoelectric performance via Bi/Cu co-doping
Rahidul Hasan, Seungki Jo, Seung Yong Lee, Yan Gu, Kyung Tae Kim, Dong Won Chun, Sang‐il Kim, Hyun‐Sik Kim, Kyu Hyoung Lee
Journal of Materiomics, 2025
22
Simultaneous Fermi Level and Weighted Mobility Engineering in CaCuP‐Based Thermoelectrics via Multi‐Route Compositional Tuning
Mikail Aktas, Minsu Heo, Se Yun Kim, Saba Sepahban Shahgoli, T. Yilmaz, Hyun‐Sik Kim, Umut Aydemir
Advanced Electronic Materials, 2025
23
High-Dielectric Ultrathin BaTiO<sub>3</sub> Anode via Electrophoretic Deposition: A Platform for Pseudocapacitive Li Storage and Interface Stabilization
Ji‐Yeon Lee, Jihye Shin, Minsu Heo, Chanyoung Yoo, Mincheol Chang, Jedo Kim, Hyun‐Sik Kim, Byoungnam Park
ACS Applied Energy Materials, 2025
24
Enhancing thermoelectric efficiency of Bi2Se3 alloys via significant reduction of lattice thermal conductivity by complementary defect structure formed by heavy Fe addition
Samuel Kimani Kihoi, Beom Soo Kim, Chang‐Woo Lee, Hyun‐Sik Kim, Sang‐il Kim
Journal of Alloys and Compounds, 2025
25
Development of two-dimensional layered ZnSb-based thermoelectric materials via alkali metal alloying
Peyala Dharmaiah, Gwang Min Park, Minsu Heo, Jong-Il Ju, Hyun‐Sik Kim, Hea Jung Park, Sung Ok Won, Tae Heon Kim, Seong Keun Kim, Jinsang Kim, Seung‐Hyub Baek
Journal of Alloys and Compounds, 2025
26
Enhanced zT of highly flexible freestanding Ag2Se films via Cu2Se nanoparticle doping for wearable thermoelectric generator applications
원종인, 문영준, 강영아, 박우민, 김현식, 김정원, 장광석
CHEMICAL ENGINEERING JOURNAL, 2025
27
Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging
C. Jung, Jae Pil Jung, Ashutosh Sharma, Hyun‐Sik Kim
Journal of Alloys and Compounds, 2025
28
Effect of Laser Beam Power on Microstructure Evolution and Interface Kinetics of Laser-Soldered Mini-Leds for Mems Packaging
Jun Ho Ku, Hyun‐Sik Kim, Ashutosh Sharma, Jae Pil Jung
SSRN Electronic Journal, 2025
29
Rapid Drying Principle for High‐speed, Pinhole‐Less, Uniform Wet Deposition Protocols of Water‐Dispersed 2D Materials
Ki‐Hun Jeong, Chansoo Kim, Ha Young Lee, Junyi Zhao, Soo‐Hyung Choi, Jun-Hyun Bae, Hyun‐Sik Kim, Jeong‐Yeon Kim, You Jin Kim, Heechae Choi, Alloyssius E.G. Gorospe, Seung Joon Yoo, Chuan Wang, Dongwook Lee
Advanced Materials, 2025
30
Effect of carbon content on electrical, thermal, and mechanical properties of pressureless sintered SiC ceramics
Yeongjun Oh, Minsu Heo, Young‐Wook Kim, Hyun‐Sik Kim