Machine learning informed rational design of high entropy double perovskite oxide universal air/steam electrodes for solid oxide electrochemical cells
Youdong Kim, Peter W. Rand, Elliot Brim, Charlie Meisel, Steven R. Goldy, Jayoon Yang, Michael Sanders, Hyun‐Sik Kim, Kanghee Jo, Hee-Soo Lee, Garritt J. Tucker, Cristian V. Ciobanu, Ryan M. Richards, Neal P. Sullivan, Ryan O’Hayre
Applied Catalysis B: Environmental, 2025
42
Mitigating Surface Deactivation for N<sub>2</sub>O Abatement Using Plasma Activated Co-reactants
Zi‐Feng Ma, Allan G. King, Jiefeng Diao, Clement H. C. Leung, Hyun‐Sik Kim, Hyunwoo Park, Graeme Henkelman, C. Buddie Mullins, Thomas C. Underwood
ACS Catalysis, 2025
43
A Boosted 3.5W, -81.6dB THD+N, 92.6% Total Efficiency, Battery-Powered Class-D Audio Amplifier with True-Zero-Switching Achieving Quiescent Current of 0.9mA
Jeong-Hyun Cho, Hyun‐Sik Kim
2025
44
Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging
Jun Ho Ku, Sri Harini Rajendran, Ashutosh Sharma, Jae Pil Jung, Hyun‐Sik Kim
Journal of Materials Science Materials in Electronics, 2025
45
Li‐Well ZnO Memtransistors: High Reliability for Neuromorphic Applications
Ki‐Hoon Son, Hyun‐Sik Kim, Dae‐Hee Han, Hyung‐Kyu Lim, Hong‐Sub Lee
Advanced Materials, 2025
46
Wearable Thermoelectric Generators Based on Flexible Ag<sub>2</sub>Se/PVDF Films: Influence of Film Geometry and Wind on Energy Harvesting
Nayeon Kim, Jong‐In Won, Yeongjun Mun, Yeong A Kang, Hyun‐Sik Kim, Jungwon Kim, Kwang‐Suk Jang
ACS Applied Materials & Interfaces, 2025
47
Microstructure and IMC growth Kinetics in SAC305/ENIG Joints Prepared via Laser Solder Ball Jetting and Multiple Reflow Cycles
Seungchan Ka, Dong Ho Bae, Ashutosh Sharma, Jae Pil Jung, Hyun‐Sik Kim
SSRN Electronic Journal, 2025
48
Aqueous Lithium Hydroxide Chemistry Based on Hierarchically Assembled Hydrogenated Borophene/Cobalt‐Nickel Compounds for Rechargeable High‐Performance Supercapattery
Seunghwan Jo, Ozden Gunes Yildiz, Hyun‐Sik Kim, Liting Zhang, Ki-Hoon Shin, S. Kwon, Keon Beom Lee, Paul Simon, Umut Aydemir, Ghim Wei Ho, Jung Inn Sohn
Advanced Energy Materials, 2025
49
Laser solder ball jetting of SAC305/ENIG joints: Microstructure, kinetics, and reliability under multiple reflow cycles
Dong Ho Bae, Ashutosh Sharma, Jae Pil Jung, Hyun‐Sik Kim
Intermetallics, 2025
50
Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging