CVD
PLD
Voltmeter
PEALD (Plasma-Enhanced Atomic Layer Deposition)
Specifications Gases Flow Type : Lateral type Available Film : Metal oxide thin film based O2 plasma & H2O, Metal thin film base H2 plasma Substrate Size & Temperature : 25 ~ 400 [℃] ± 1 [%] On The Substrate of 150x150[mm²]
PLD (Pulsed Laser Deposition)
Specifications Uniformity Zone of Substrate Heating :Ø15 mm Substrate Temperature : 850°C ± 5°C in oxygen Operating Pressure : 0.01 mTorr ~ 10 Torr Target Carousel : one inch (25.4mm) diameter for four targets
RF & DC Sputtering System (KVS-2000)
Specifications PROCESS CHAMBER MATERIAL : SUS 304 SIZE : Φ265 X 300(H) 2.75" CF FLANGE FOR GAUGE & GAS & EXTRA PORT 1.33" CF FLANGE FOR SHUTTER PORT VACUUM PUMPING UNIT TURBO PUMP & ROTARY VACUUM PUMP SUBSTRATE UNIT MAX TEMPERATURE : UP TO 750℃ SUBSTRATE HOLDER : 3.5" SUS SPUTTERING GUN SOURCE MAGNET : Nd-Fe-B N TYPE POWER CONNECTOR R.F POWER SUPPLY & DC POWER SUPPLY
Probe Station
Specifications Temperature: ~ 850 °C Cryostat: ~ 4 K Fiber: 300 ~ 1400nm Waverlength RF: ~ 67GHz
AFM (Atomic Force Microscope)
Specifications Position sensitive quadrant photo detector optimized for laser wavelength. <25 fm/Hz½ noise floor (noise level: 0.02 nm), Modular, flexible design to include optional modes 50 mm range, 250 nm resolution motorized Z Stage 76 mm range, 50 nm resolution motorized XY Stage Contact, Dynamic, EFM, PFM, CAFM, KFM modes
PECVD (Plasma-Enhanced CVD)
Specifications Base pressure : ~10(-6) Torr · Gas : Ar, O2, N2 Max, temp : about 1,100 degree C Power : RF(13.56MHz, 600W) System control by touch panel Automatic Pressure control
Mist-CVD (Chemical Vapor Deposition)
Specifications Pump : Rotary Oil pump Base pressure : ~10(-3) Torr Max, temp : about 1,100 degree C Heating method : Furnace Gas : Ar, N2 Pressure control : Manual Throttle valuve