Effects of film thickness and deposition rate on the diffusion barrier performance of titanium nitride in Cu-through silicon vias
Yeon, Han-Wool[Yeon, Han-Woo, Lee, Young-Joo[Lee, Young-Jo, Jung, Sung-Yup[Jung, Sung-Yu, Na, Se-Kwon[Na, Se-Kwon], Park, Jong-Seung[Park, Jong-, Choi, Yong-Yoon[Choi, Yong-Y, Lee, Hoo-Jeong[Lee, Hoo-Jeon, Song, Oh-Sung[Song, Oh-Sung], Joo, Young-Chang[Joo, Young-
Electronic Materials Letters, 201401