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전체 논문

371

301

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
JAPAN INST METALS, 1-14-32 ICHIBANCHO AOBA-KU, SENDAI, JAPAN, 980-8544, 2012

302

Thermal conductivity of a graphene oxide？carbon nanotube hybrid/epoxy composite
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB, 2012

303

Low Swelling Poly(ester) Urethane Composite Containing Modified Hollow Glass Microspheres for Seawater-Resistant Encapsulant
POLYMER SOC KOREA, ROOM 601, HATCHON BUILDING, 831 YEOKSAM-DONG, KANGNAM-KU, SEOUL, SOUTH KOREA, 135-792, 2012

304

Sulfonated Multiwalled Carbon Nanotube/Sulfonated Poly(ether sulfone) Composite Membrane with Low Methanol Permeability for Direct Methanol Fuel Cells
WILEY-BLACKWELL, 111 RIVER ST, HOBOKEN, USA, NJ, 07030-5774, 2012

305

Low Methanol Permeable Sulfonated Poly(ether imide)/Sulfonated Multiwalled Carbon Nanotube Membrane for Direct Methanol Fuel Cell
WILEY-BLACKWELL, 111 RIVER ST, HOBOKEN, USA, NJ, 07030-5774, 2012

306

Flexible and high thermal conductivity thin films based on polymer:Aminated multi-walled carbon nanotubes/micro-aluminum nitride hybrid composites
ELSEVIER SCI LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OXON, OX5 1GB, 2012

307

The influence of Al(OH)3-coated graphene oxide on improved thermal conductivity and maintained electrical resistivity of Al2O3/epoxy composites
SPRINGER, VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ, 2012

308

Effect of homogeneous Al(OH)3 covered MWCNT addition on the thermal conductivity of Al2O3/epoxy-terminated poly(dimethylsiloxane) composites
SPRINGER, 233 SPRING ST, NEW YORK, USA, NY, 10013, 2012

309

Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
PERGAMON-ELSEVIER SCIENCE LTD, THE BOULEVARD, LANGFORD LANE, KIDLINGTON, OXFORD, ENGLAND, OX5 1GB, 2012

310

Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)
JAPAN INST METALS, 1-14-32 ICHIBANCHO AOBA-KU, SENDAI, JAPAN, 980-8544, 2012