Electrical Conductivity Behavior of 6FDA-based Fluorinated Polyimide/PMMA-g-MWCNT Nanocomposite Film

Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler

Enhancement of Wetting Characteristics for Anisotropic Conductive Adhesive with Low Melting Point Solder via Carboxylic Acid-based Novel Reductants

Transport Properties of Fluorinated Polyimide/PMMA-g-Silica Nanocomposite Membrane

Enhancement of Gas Selectivities of Hexafluoroisopropylidene-Based Polyimides with Poly(Methylmethacrylate) Blending

Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers

Curing Kinetics and Mechanical Properties for Siloxane Contained ETSO-DDM/BPH Epoxy System

Novel Miscible Blends Composed of Poly(Methyl Methacrylate) and 2,2-Bis(3,4-Carboxyphenyl)Hexafluoropropane Dianhydride-Based Polyimides with Optical Grade Clarity

Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)

금속산화물을 포함한 변성폴리실록산/금속 복합체의 전기 전도성 연구