발행물
컨퍼런스
IEEE, ICECCE, KUALA LUMPUR, MALAYSIA
2021
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Copper Loss Reduction of Torque Sharing Function in Switched Reluctance Motor by Division of Commutation Region
16th VMIC(VLSI Multilevel Interconnection Conference) Conference proceedings
1999
Study of Diffusion Barrier Properties of Ionized Metal Plasma (IMP) Deposited TaN Between Cu and SiO2
1st Conference on Thermophysical Properties of Materials
1999.11
ANALYSIS OF RESISIVITY MEASUREMENTS ON THIN FILMS.
ECTC Conference Proceedings
1998
Preparation and Characterization of Reworkable High Temperature Adhesives for Microelectronic Applications.
11th Annual Symposium of the Laboratory for Surface Modification, State University of New Jersey
1997.02
Growth and Characterization of Thermal Silicon dioxide on 6H-SiC