발행물

전체 논문

166

101

Suppression of Cu agglomeration in the Cu/Ta/Si structure by capping layer
임재원, K. Mimura, M. Isshiki
Science and Technology of Advanced Materials, 200307

102

고주파 스퍼터타입 이온소스를 이용한 비지량분리형 이온빔증착법에 관한 특성연구
임재원, 0
한국진공학회지, 200307

103

Effect of substrate bias voltage on the purity of Cu films deposited by non-mass separated ion beam deposition
임재원, K. Mimura, K. Miyake, M. Yamashita, M. Isshiki
Thin Solid Films, 200306

104

Characteristics of IBD Cu thin films as a seed layer: Effect of negative substrate bias voltage
임재원, K. Miyake, M. Isshiki
Thin Solid Films, 200306

105

Effect of substrate bias voltage on the thermal stability of Cu/Ta/Si structures deposited by ion beam deposition
임재원, K. Mimura, K. Miyake, M. Yamashita, M. Isshiki
JAPANESE JOURNAL OF APPLIED PHYSICS, 200305

106

Preparation of high-purity Cu films by non-mass separated ion beam deposition
임재원, K. Mimura, K. Miyake, M. Yamashita, M .Isshiki
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B, 200305

107

Influence of substrate bias voltage on the properties of Cu films by sputter type ion beam deposition
임재원, Y. Ishikawa, K. Miyake, M. Yamashita, M. Isshiki
Materials Transactions, 200206

108

Improvement of Ta barrier film properties in Cu interconnection by using a non-mass separated ion beam deposition method
임재원, Y. Ishikiwa, K. Miyake, M. Yamashita, M. Isshiki
Materials Transactions, 200203

109

Mg2NiHx 수소화거동에 미치는 기계적합금화 공정의 영향
임재원, 0, 0, 0, 0, 0
수소에너지, 199906

110

수소인가형 기계적 합금화법에 의한 Mg2NiHx 수소저장합금의 제조
임재원, 0, 0, 0, 0
대한금속·재료학회지, 199903