2014

,

Measurement of Mechanical Properties of Advanced Ultra-Thin Films using Water surface Platform

2014

,

Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

2014

,

Measurement of Thermal Expansion Coefficient of FR4 Using Digital Image Correlation System for Warpage Prediction of Package Substrate

2014

,

Measurement of Mechanical Properties of Advanced Thin Films using Water Surface

2014

,

Measurement of Hygroscopic Properties and Warpage of Polymer Substrate by Using Digital-Image-Correlation