2014

,

Warpage analysis of electroplated Cu films on polymer based packaging core substrate

2014

,

A highly sensitive, flexible capacitive pressure sensor based on porous dielectric elastomer

2014

,

Joining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump

2014

,

Interfacial adhesion and diffusion barrier characteristics of graphene layer

2014

,

Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers