발행물
컨퍼런스
Rials and Reliability
2019
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Effect of Femtosecond Laser Machining Environment on Mechanical Behaviors of Thinned Silicon
The 18th International Symposium on Microelectronics and Packaging-The 21th Electronic Materials and Packaging (ISMP-EMAP)
Enhancement of Movement Speed of Soft Actuator Utilizing Diamagnetic Levitation
The 20th International Meeting on Information Display
2020
Strategies for Mechanically Reliable Thin-Film Flexible Electronics
Electrochemical Society Meeting (ECS)
2021
Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes
The 19th International Symposium on Microelectronics and Packaging (ISMP)
Optimization of Cu Interconnects-SiCN Interfacial Adhesion by Surface Treatments