발행물
컨퍼런스
2019 IMAPS International Symposium on Microelectronics
2019
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Early detection and instantaneous cause analysis of defects in interconnects by machine learning (ranking-CNN) of scattering parameter patterns
2019 MRS Fall Meeting & Exhibit
Tensile Properties of ALD Alumina without Substrate Measured by Tensile Testing on Water Surface
5th International Conference on Materials and Reliability
Effect of Donor/Acceptor Blend Ratio and Molecular Weight of Polymer Acceptor on Fracture Behavior of All-Polymer Solar Cells
IEEE International Flexible Electronics Technology Conference (IFETC)
Strategies for Mechanically Reliable Thin-Film Flexible Electronics
International Conference on Electronics Packaging (ICEP)
Warpage Analysis of Flexible Electronics