발행물
컨퍼런스
ISMP 2015
2015
,
Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding
International Conference on Electronic Packaging
Mechanical Reliability of Advanced Thin Films
Materials Research Society Spring Meeting
Exploiting DMSO to Enhance Mechanical and Electrical Properties of PEDOT:PSS Conducting Polymer Films
Solving Adhesion and Reliability Issues for Fuel Cells
The Fourth International Forum on Environment and Energy Science
The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015
Development of Quantitative Adhesion Measurement Method for SOFC