발행물
컨퍼런스
ISMP 2018
2018
,
Measurement of equivalent modulus of chip package using bending test
PRCR 2018
Comparative Study of Decohesion and Tensile Properties of All-Polymer and Fullerene-Polymer Solar Cells
Study of Fracture and Tensile Properties of All-Polymer and Fullerene-Polymer Solar Cells Based on Same Polymer Donor
APS march meeting
ng Soft Hydrogel by using pH Responsive Microbilayer with Mechanically Optimized Designs
2018 MRS Spring
2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
2019
Effects of the Materials Properties of Epoxy Molding Films (EMFs) on Fan-Out Packages (FOPs) Characteristics