발행물

전체 논문

271

121

Design of ultrathin OLEDs having oxide -based transparent electrodes and encapsulation with sub -mm bending radius
Kim, E[Kim, Eungjun], Kwon, J[Kwon, Jeonghyun], Kim, C[Kim, Cheolgyu], Kim, TS[Kim, Taek-Soo], Choi, KC[Choi, Kyung Cheol], Yoo, S[Yoo, Seunghyup]
ORGANIC ELECTRONICS, 2020

122

A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films
Pan, Y[Pan, Yan], Oh, SJ[Oh, Seung-Jin], Kim, JH[Kim, Ji-Hye], Kim, TS[Kim, Taek-Soo], Paik, Kyung-Wook
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020

123

Human-Palm-Inspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation
Heo, SH[Heo, Si-Hwan], Kim, C[Kim, Cheolgyu], Kim, TS[Kim, Taek-Soo], Park, HS[Park, Hyung-Soon]
ADVANCED FUNCTIONAL MATERIALS, 2020

124

Mechanically Robust All-Polymer Solar Cells from Narrow Band Gap Acceptors with Hetero-Bridging Atoms
Fan, QP[Fan, Qunping], Su, WY[Su, Wenyan], Chen, SS[Chen, Shanshan], Kim, W[Kim, Wansun], Chen, XB[Chen, Xiaobin], Lee, B[Lee, Byongkyu], Liu, T[Liu, Tao], Mendez-Romero, UA[Mendez-Romer, Ma, RJ[Ma, Ruijie], Yang, T[Yang, Tao], Zhuang, WL[Zhuang, Wenliu], Li, Y[Li, Yu], Li, YW[Li, Yaowen], Kim, TS[Kim, Taek-Soo], Hou, LT[Hou, Lintao], Yang, C[Yang, Changduk], Yan, H[Yan, He], Yu, DH[Yu, Donghong], Wang, EG[Wang, Ergang]
JOULE, 2020

125

A Study on the Flexible Chip-on-Fabric Assemblies Using Anisotropic Conductive Films and Metal-Laminated Fabric Substrates
Jung, SY[Jung, Seung-Yoon], Lee, TI[Lee, Tae-Ik], Cho, M[Cho, Minsun], Kim, TS[Kim, Taek-Soo], Paik, Kyung-Wook
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020

126

Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers
Lee, S[Lee, Sangmin], Kim, JH[Kim, Jae-Han], Kim, YS[Kim, Young Suk], Ohba, T[Ohba, Takayuki], Kim, TS[Kim, Taek-Soo]
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020

127

Origin of the High Donor Acceptor Composition Tolerance in Device Performance and Mechanical Robustness of All-Polymer Solar Cells
Lee, JW[Lee, Jin-Woo], Ma, BS[Ma, Boo Soo], Choi, J[Choi, Joonhyeong], Lee, J[Lee, Junbok], Lee, S[Lee, Seungjin], Liao, K[Liao, Kin], Lee, W[Lee, Wonho], Kim, TS[Kim, Taek-Soo], Kim, Bumjoon J.
CHEMISTRY OF MATERIALS, 2020

128

A Study on the Fabric Substrates With Fine-Pitch Laminated Cu Metal Patterns Using B-Stage Adhesive Films
Jung, SY[Jung, Seung-Yoon], Oh, SJ[Oh, Seung Jin], Lee, TI[Lee, Tae-Ik], Kim, TS[Kim, Taek-Soo], Paik, Kyung-Wook
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020

129

Effect of High Film Stress of Mo Source and Drain Electrodes on Electrical Characteristics of Al Doped InZnSnO TFTs
Bae, J[Bae, Jaehan], Ma, BS[Ma, Boo Soo], Jeon, G[Jeon, Gukjin], Jeong, W[Jeong, Wooseok], Je, CH[Je, Chang Han], Kim, TS[Kim, Taek-Soo], Park, SHK[Park, Sang-Hee Ko]
IEEE ELECTRON DEVICE LETTERS, 2019

130

Aqueous-Soluble Naphthalene Diimide-Based Polymer Acceptors for Efficient and Air-Stable All-Polymer Solar Cells
Lee, SJ[Lee, Seung Jin], Kim, Y[Kim, Youngwoong], Jeong, D[Jeong, Dahyun], Kim, TS[Kim, Taek-Soo], Kim, Bumjoon J., Wu, Z[Wu, Ziang], Lee, C[Lee, Changyeon], Oh, SJ[Oh, Seung Jin], Luan, NT[Nguyen Thanh Luan], Lee, J[Lee, Junbok], Zhang, K[Zhang, Kai], Huang, F[Huang, Fei], Woo, HY[Woo, Han Young]
ACS APPLIED MATERIALS & INTERFACES, 2019