발행물

전체 논문

271

171

Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics
Seo, JW[Seo, Ji Won], Joo, M[Joo, Munkyu], Ahn, J[Ahn, Jaeho], Lee, TI[Lee, Tae-Ik], Kim, TS[Kim, Taek-Soo], Im, SG[Im, Sung Gap], Lee, JY[Lee, Jung-Yong]
NANOSCALE, 2017

172

Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump
Kim, YS[Kim, Youngsoon], Yoon, T[Yoon, Taeshik], Kim, TW[Kim, Tae-Wan], Kim, TS[Kim, Taek-Soo], Paik, Kyung-Wook
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017

173

Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics
Rodriquez, D[Rodriquez, Daniel, Kim, JH[Kim, Jae Han], Root, SE[Root, Samuel E.], Fe, ZP[Fe, Zhuping], Boufflet, P[Boufflet, Pierre], Heeney, M[Heeney, Martin], Kim, TS[Kim, Taek-Soo], Lipomi, DJ[Lipomi, Darren J.]
ACS APPLIED MATERIALS INTERFACES, 2017

174

Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells
Kim, TS[Kim, Taek-Soo], Lee, I[Lee, Inhwa], Yun, JH[Yun, Jae Hoon], Son, HJ[Son, Hae Jung]
ACS APPLIED MATERIALS INTERFACES, 2017

175

Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester
Park, JH[Park, Jung Hwan], Hwang, GT[Hwang, Geon-Tae], Kim, SH[Kim, Shin-Ho], Seo, JM[Seo, Jeongmin], Park, HJ[Park, Hong-Jin], Yu, Kyoungsik, Kim, TS[Kim, Taek-Soo], Lee, KJ[Lee, Keon Jae]
ADVANCED MATERIALS, 2017

176

Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate
Yang, M[Yang, Ming], Ko, YH[Ko, Yong Ho], Bang, J[Bang, Junghwan], Kim, TS[Kim, Taek-Soo], Lee, CW[Lee, Chang-Woo], Li, M[Li, Mingyu]
MATERIALS CHARACTERIZATION, 2017

177

Understanding mechanical behavior and reliability of organic electronic materials
Kim, TS[Kim, Taek-Soo], Rolston, N[Rolston, Nicholas], Watson, BL[Watson, Brian L.], Dauskardt, RH[Dauskardt, Reinh, Kim, JH[Kim, Jae Han], Lee, I[Lee, Inhwa]
MRS BULLETIN, 2017

178

A quantitative strain analysis of a flexible single-crystalline silicon membrane
Kim, TS [Kim, Taek-Soo], Bong, JH[Bong, Jae Hoon], Kim, C[Kim, Cheolgyu], Hwang, WS[Hwang, Wan Sik], Cho, Byung Jin
APPLIED PHYSICS LETTERS, 2017

179

Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly
Kim, TW[Kim, Tae-Wan], Lee, TI[Lee, Tae-Ik], Pan, Y[Pan, Yan], Kim, W[Kim, Wansun], Zhang, S[Zhang, Shuye], Kim, TS[Kim, Taek-Soo], Paik, Kyung-Wook
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016

180

Flexural and tensile moduli of flexible FR4 substrates
Lee, TI[Lee, Tae-Ik], Kim, C[Kim, Cheolgyu], Kim, MS[Kim, Min Sung], Kim, TS[Kim, Taek-Soo]
POLYMER TESTING, 2016