발행물
컨퍼런스
6th Electronics Packaging Technology Conference, EPTC 2004
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Chip-package co-design of power distribution network for system-in-package applications
7th Electronics Packaging Technology Conference, EPTC 2005
10Gbps backplane design methodology with sensitivity analysis and statistical analysis
IEEE 1st Asian-Solid State Circuits Conference
Network-on-Chip and Network-in-Package for High-Performance SoC
1st IEEE Asian Solid-State Circuits Conference, ASSCC 2005
Networks-on-chip and networks-in-package for high-performance SoC platforms
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Near field and far field analysis of Alternating Impedance Electromagnetic Bandgap (AI-EBG) structure for mixed-signal applications