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High frequency electrical model of through wafer via for 3-D stacked chip packaging

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Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling

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TDR/TDT analysis by crosstalk in single and differential meander delay lines for high speed PCB applications

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Modeling and measurement of radiated emission through a cutout on the power/ground plane

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Modeling and simulation of IC and package power/ground network