발행물
컨퍼런스
8th VLSI Packaging Workshop
,
Fast and Efficient Method for Impedance of System Power/Ground Network Including Package-Board Structure
2006 MRS Fall Meeting
Fabrication and evaluation of 3D packages with through hole via
China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems
Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm
14th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP
Networks-in-package; design, analysis and implementation
IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging
Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems