발행물
컨퍼런스
IEEE International Symposium on Electromagnetic Compatibility, EMC 2007
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Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization
57th Electronic Components and Technology Conference 2007, ECTC `07
Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV)
World Congress on Structural and Multidisciplinary Optimization
A Delay Line Circuit Layout For Crosstalk Minimization Using Genetic Algorithm and Experimental Verification
International Workshop on Electromagnetic Compatibility of Integrated Circuits
Modeling of Chip Level Power Distribution Network Based on Segmentation Method
Causal Transient Simulation of Magnitude Equalized Signal on High-speed Interconnects