발행물
컨퍼런스
IEEE International Symposium on Electromagnetic Compatibility, EMC 2007
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Implementation of on-chip and on-package reactive equalizer to minimize inter-symbol interference (ISI) and jitter from frequency dependent attenuation
Modeling and verification to analyze effect of power/ground noises on CMOS feedback operational amplifier
Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure
Noise isolation modeling and experimental validation of power distribution network in chip-package
Design of UWB transceiver SiP for short range communication