발행물
컨퍼런스
9th Electronics Packaging Technology Conference, EPTC 2007
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Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID
Analysis of the effect of digital power ground noise on active balun in UHF RTID SiP
Analysis of the effect of AC noise on DC bias of VGA for UHF RFID using chip-package co-modeling and simulation
International Conference on Electronic Materials and Packaging, EMAP 2007
Electrical characterization of Trough Silicon Via (TSV) depending on structural and material parameters based on 3D full wave simulation
Symposium on Microelectronics (IMAPS)
Discontinuity cancellation to boost package bandwidth up to material`s limitation