발행물
컨퍼런스
Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008)
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An On-Chip Signal Integrity Characterization Scheme for Gbps Data Transmission Channel
IEEE Electrical Design of Advanced Packaging and Systems Symposium
A Frequency Clock Distribution Scheme Using Bond-Wire Inductor
A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network
Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package
IEEE Electromagnetic Compatibility Symposium, EMC
Power/ground Noise Immunity Test in Wireless and High-speed UWB Communication System