발행물
컨퍼런스
14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
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A 2-dimensional distributed equivalent circuit model of EBG power distribution network
High frequency electrical circuit model of chip-to-chip vertical via iterconnection for 3-D chip stacking package
IEEE 14th(13) Topical Meeting on Electrical Performance of Electronic Packaging
High-frequency Electrical Model of Chip-to-Chip Via Interconnection for 3-D Chip Stacking Package
International Symposium on Electromagnetic Compatibility, EMC 2005
Broadband suppression of SSN and radiated emissions using high-DK thin film EBG power distribution network for high-speed digital PCB applications
The 55th Electronic Components and Technology Conference, ECTC
Frequency behavior of embedded epoxy/SrTiO3 composite capacitor materials