발행물
컨퍼런스
표면공학회 춘계학술대회
2018
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A Study on the Cobalt Electtodeposition for High Aspect Ratio Through-Silicon-Via (TSV) with Single Additive
Synthesis of Cl- ion sensors based on CNT, CuBTC, and silver nanoparticles.
IITC 2018
Effective Methods Controlling Cu Overburdens for Cu RDL Process
KCS 2018
Electrochemical Polishing of Cu Redistribution Layers for Fan Out Wafer Level Packing
Durabi 2018
A study on Cl- ion sensors based on CNT, CuBTC, and silver nanoparticles