발행물
컨퍼런스
IITC2015(International Interconnect Technology Conference/Materials for Advanced Matallization Conference)
2015
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Enhancement of Cu Through-Silicon-Via(TSV) Filling Rate by Applying Pulse wave form Current
2015 한국표면공학회 춘계학술대회
The Effects of Temperature on Mechanical Properties in Pulse-Electrodeposited Cu Thin Film
제22회 한국반도체학술대회
Characteristics of Through0Si-Via(TSV) Filling by Electrodeposition with pulse Wave Form current
미래반도체소자 산업핵심기술개발사업 총괄워크샵
High Aspect Ratio 미세 via 증착 기술
OSA2014
2014
Thin Si wafering(? 100um) with electrodeposit-assisted stripping(EAS) process for Solar cell Applications