발행물

전체 논문

58

1

Low-Temperature Diffusion of Au and Ag Nanolayers for Cu Bonding
S. Lee, S. Park, S. E. Kim
Applied Sciences, 2023

2

Guidelines for Area Ratio between Metal Lines and Vias to Improve the Reliability of Interconnect Systems in High-Density Electronic Devices
T. Hong, S. E. Kim, J. Park, S. Hong
electronics, 2023

3

Effect of the annealing process on Cu bonding quality using Ag nanolayer
Y. Kim, S. E. Kim
IEEE TCPMT, 2023

4

Nano-capsuled thermal interface materials filler using defective multilayered graphene-coated silver nanoparticles
S. Choi, D. Shin, S. E. Kim, C. Lee
Microelectronic Engineering, 2023

5

Copper Bonding Technology in Heterogeneous Integration
Y. Lee, M. Mclnerney, Y. Yoo, I. Choi, S. E. Kim
Electronic Materials Letters, 2023

6

Thermo-Mechanical Challenges of 2.5D Packaging: A Review of Warpage and Interconnect Reliability
H. Kim, J. Hwang, S. E. Kim, Y. Joo, H. Jang
IEEE TCPMT, 2023

7

A Review of Cell Operation Algorithm for 3D NAND Flash Memory
J. K. Park, S. E. Kim
Appl. Sci., 2022

8

Low temperature diffusion behavior of Ti in Cu/Ti-Ti/Cu bonding
S. Park, Y. Kim, S. E. Kim
Journal of Electronic Materials, 2022

9

Fabrication of multilayer Graphene-coated Copper nanoparticles for application as a thermal interface material
D. Shin, S. Choi, S. E. Kim, C. Yun, Y. Tan, C. S. Lee
Applied Surface Science, 2022

10

Evaluation of 12nm Ti layer for low temperature Cu-Cu bonding
S. Park, Y. Kim, S. E. Kim
J. Microelectron. Packag. Soc., 2022