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Packaged electroosmotic pumps using porous frits for cooling integrated circuits
7,274,106
Capacitor with insulating nanostructure
7,271,434
Capacitor with conducting nanostructure
7,265,406
Method and device for on-chip decoupling capacitor using nanostructures as bottom
7,244,983
Cooling micro-channels
7,227,257
Method and apparatus for low temperature copper to copper bonding
7,183,648
Self-aligned electrodes contained within the trenches of an electroosmotic pump fabricated in silicon or glass
7,105,382
Electroosmotic pumps using porous frits for cooling integrated circuit stacks
7,084,495
Methods of forming backside connections on a wafer stack
7,056,813
Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack
7,056,807
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