Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode

Etch stop layer for silicon (si) via etch in three-dimensional (3-d) wafer-to-wafer vertical stack

Barrier structure against corrosion and contamination in three-dimensional (3-d) wafer-to-wafer vertical stack

Process of vertically stacking multiple wafers supporting different active integrated circuit (ic) devices

Thinning techniques for wafer-to-wafer vertical stacks

Fabrication of 3-d capacitor with dual damascene process

Method and structure for interfacing electronic devices

Dielectric recess for wafer-to-wafer and die-to-die bonding and method of fabricating the same