Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Ultra-high capacitance device based on nanostructures

Etch thinning techniques for wafer-to-wafer vertical stacks

Differential Planarization

Using external radiators with electroosmotic pumps for cooling integrated circuits

Electro-osmotic pumps and micro-channels

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration and application

3차원 구조물 상 증착 박막을 기반한 실리콘 커패시터 및 그의 제조방법

열계면층을 포함하는 반도체 소자 패키지 및 그 제조 방법