발행물
컨퍼런스
2006 Spring Meeting of the Materials Research Society (MRS), San Francisco, CA, USA
2006
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In-situ Observation of the Formation and Growth of Twin in the Copper Electrodeposits for Ultra Large Scale Integration
The Stepwise Cross-sectional Crystalline Analysis of the Stress Induced Voiding in Cu Interconnect
2005 Fall Meeting of the Materials Research Society (MRS), Boston, MA, USA
2005
A Study on the Mechanisms of Generation and Growth of Stress Induced Voiding in Cu Interconnect
2005 Fall Conference of the Korean Institute of Metals and Materials (2005년도 대한금속?재료학회 추계 학술대회), KINTEX, Kyunggi-do, Korea
Annealing Textures of Copper Damascene Interconnects for Ultra Large Scale Integration
56th Annual Meeting of the International Society of Electrochemistry (ISE), BEXCO, Busan, Korea
Effect of Current Waveform on Submicron Scale Electrodeposition