발행물

전체 논문

76

1

Robust Heteroepitaxial Growth of GaN Formulated on Porous TiN Buffer Layers
이효종, 김종범, 정희석, 오규환, 한흥남, 임태환, 김정한
CRYSTAL GROWTH & DESIGN, 2023

2

Multilayer Laminated Copper Electrodeposits and Their Mechanical Properties
신한균, 김상혁, 박현, 이효종
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2022

3

Microstructure and Texture in Copper Filled Millimeter Scale Through Silicon Vias
김상혁, Trevor Braun, 이효종, TP Moffat, D Josell
Journal of The Electrochemical Society, 2022

4

Effect of Chloride on Microstructure in Cu Filled Microscale Through Silicon Vias
이효종, 김상혁, TM Braun, TP Moffat, D Josell
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2021

5

Bottom-up Cu filling of annular through silicon vias: Microstructure and texture
이효종, 김상혁, Daniel Josell, Thomas Moffat
Electrochimica Acta, 2020

6

Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling
김상혁, 이효종, 김민재, 임태호, 김재정
ELECTROCHIMICA ACTA, 2019

7

Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction (vol 165, pg D23, 2018)
이효종, TM Braun, 김상혁, TP Moffat, D Josell
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018

8

Improvement of efficiency in graphene/gallium nitride nanowire on Silicon photoelectrode for overall water splitting
배효정, 노호균, 민정욱, 이효종, 이용탁, 이상현, Katsushi Fujii, 하준석
APPLIED SURFACE SCIENCE, 2017

9

Effects of NiP Nodule Interfacial Morphology on Solder-Ball-Joint Reliability
이효종, 허석환, 김근수
NANOSCIENCE AND NANOTECHNOLOGY LETTERS, 2017

10

The Effect of the number of InGaN/GaN pairs on the photoelectrochemical properties of InGaN/GaN multi quantum wells
배효정, 박준범, Katsushi Fujii, 이상현, 류상완, 이준기, 하준석, 이효종
Applied Surface Science, 2017