발행물

전체 논문

76

41

Structural Investigation of Nitrided C-sapphire Substrate by Grazing Incidence X-ray Diffraction and Transmission Electron Microscopy
이효종, 하준석, 이석우, 이현재, Hiroki Goto, 이상현, 조명환, Takafumi Yao, Tsutumo Minegishi, Takahashi Hanada, 홍순구, Osami Sakata, 이재욱, 이정용
Applied Physics Letters, 2007

42

Free Standing GaN Layers with GaN Nanorod Buffer Layer
이효종, 이현재, 이석우, Hiroki Goto, 하준석, K. Fujii, 조명환, Takafumi Yao
physica status solidi c, 2007

43

Characterization of Free-standing GaN Substrates Prepared by Self Lift-off
이효종, 이석우, Hiroki Goto, Tsutumo Minegishi, 이욱현, 하준석, 이현재, 이상현, Takenari Goto, Takashi Hanada, 조명환, Takafumi Yao
physica status solidi c, 2007

44

Strain-free GaN Thick Films Grown on Single Crystalline ZnO Buffer Layer with In-situ Lift-off Technique
이효종, 이석우, Tsutumo Minegishi, 이욱현, Hiroki Goto, 이현재, 이효종, 하준석, Takenari Goto, T. Hanada, 조명환, Takafumi Yao
Applied Physics Letters, 2007

45

In-situ Observation of the Grain Growth of the Copper Electrodeposits for Ultralarge Scale Integration
이효종, 한흥남, 김도현, 이의형, 오규환, 차필령
Applied Physics Letters, 2006

46

A Study of Copper Electroplating in the Submicron Scale Patterns
이효종, 이의형, 손헌준, 강탁
Electrochemical Solid-State Letters, 2006

47

Annealing Textures of Copper Damascene Interconnects for Ultra Large Scale Integration
이효종, 한흥남, 이동녕
Journal of Electronic Materials, 2005

48

Texture Investigation in Cu Damascene Interconnects During Annealing
이효종, 조재영, 김형배, J. Szpunar
Material Science Forum, 2005

49

Textural and Microstructural Transformation of Cu Damascene Interconnects after Annealing
이효종, 조재영, 김형배, J. Szpunar
Journal of Electronic Materials, 2005

50

Electron Backscattered Diffraction Analysis of Copper Damascene Interconnect for Ultralarge-scale Integration
이효종, 김동익, 안정훈, 이동녕
Thin Solid Films, 2005