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1
Material removal rate model in chemical-mechanical polishing using micro-structured pads
Seounghee Yun, Hyun Jun Ryu, Sanha Kim
International Journal of Mechanical Sciences, 2025
2
Hot-end co-extrusion of multiple thermoplastic filaments for unblended composite additive manufacturing
Taemin Kim, Sanha Kim
Virtual and Physical Prototyping, 2025
3
A mechanics-based predictive model for scratching defects and its application for pad selection in chemical mechanical polishing
Hyeongmin Je, Dong Geun Kim, Seounghee Yun, Somin Shin, Haesung A. Lee, Hyunsoo Kim, Sanha Kim
Tribology International, 2025
4
Nanoporous capillary gripper for ultragentle micro-object manipulation
Seong Jae Kim, Taehoon Kim, Hyun Jun Ryu, Ji-hun Jeong, A. John Hart, Sanha Kim
Advanced Science, 2025
5
Ultrathin 3D Cu/Li composite with enhanced Li utilization for high energy density Li-metal battery anodes
Inyeong Yang, Hyunwoong Baek, Dong Geun Kim, Sanha Kim
Small, 2025
6
Autonomous process optimization of tabletop CNC milling machine using computer vision and deep learning
Filippo Danilo Michelacci, Gyuhyeon Han, Sanha Kim
CIRP Journal of Manufacturing Science and Technology, 2025
7
Particle-on-demand electrohydrodynamic printing from a reciprocating tip
Ji-hun Jeong, Seong Jae Kim, Sanha Kim, A. John Hart
Journal of Manufacturing Processes, 2025
8
Preface for autonomous manufacturing with green technology
Martin B-G Jun, Young Tae Cho, Sanha Kim, Seok Kim
International Journal of Precision Engineering and Manufacturing-Green Technology, 2025
9
Mitigation of Cu dishing in chemical mechanical polishing using micro-structured pads
Seulah Park, Sukkyung Kang, Dong Geun Kim, Sanha Kim
CIRP Annals - Manufacturing Technology, 2025
10
Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision
Guseon Kang, Jaeyoon Kim, Jun Hyung Park, Sukkyung Kang, Dong Geun Kim, Young Jin Kim
CIRP Annals - Manufacturing Technology, 2025
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