발행물

전체 논문

153

91

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging
KS Jang, YS Eom, KS Choi, HC Bae
Polymer International, 2018

92

Mechanics and rheology of basalt fiber-reinforced polycarbonate composites
KS Jang
Polymer, 2018

93

Interconnection process using laser and hybrid underfill for LED array module on pet substrate
KS Choi, WAB Junior, KS Jang, SH Moon, HC Bae, YS Eom, MK Cho
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018

94

Versatile epoxy/phenoxy/anhydride-based hybrid adhesive films for deoxidization and electrical interconnection
KS Jang, YS Eom, KS Choi, HC Bae
Industrial & Engineering Chemistry Research, 2018

95

Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock test
WA Bragança, YS Eom, J Son, KS Jang, HC Bae, SH Moon, KS Choi
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017

96

Development of stacking process for 3D TSV (through silicon via) structure using laser
KS Choi, WA Braganca, KS Jang, HC Bae, YS Eom
International Symposium on Microelectronics 2017, 2017

97

Low-temperature sintering behavior of ternary solder and copper powder for high-power device packaging
YS Eom, KS Jang, JH Son, HC Bae, KS Choi
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017

98

Solvent-free fluxing underfill film for electrical interconnection
KS Jang, YS Eom, KS Choi, HC Bae
2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017

99

Hidden Innovations in the Fourth Industrial Revolution: Electronic Packaging Technology
KS Choi, SH Moon, HC Bae, KS Jang, YS Eom
Electronics and Telecommunications Trends, 2017

100

Mechanically tunable dual-component polyolefin fiber mats via two-dimensional multilayer coextrusion
WR Lenart, KS Jang, AM Jordan, E Baer, LSTJ Korley
Polymer, 2016