발행물

전체 논문

153

71

Method of fabricating a semiconductor package
KS Choi, Y Eom, KS Jang, SH Moon, HC Bae, I Jeong, WAB Junior
US Patent, 2020

72

Low-density polycarbonate composites with robust hollow glass microspheres by tailorable processing variables
KS Jang
Polymer Testing, 2020

73

Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
YS Eom, KS Choi, GM Choi, KS Jang, JH Joo, CM Lee, SH Moon, JT Moon
Electronics and Telecommunications Trends, 2020

74

Conductive adhesive with transient liquid-phase sintering technology for high-power device applications
장건수, 엄용성, 손지혜, 배현철, 최광성
ETRI Journal, 2019

75

Collective laser-assisted bonding process for 3D TSV integration with NCP
장건수, Braganca, WA (Braganca, Wagno, Eom, YS (Eom, Yong-Sung), Moon, SH (Moon, Seok Hwan), Bae, HC (Bae, Hyun-Cheol), Choi, KS (Choi, Kwang-Seong)
ETRI JOURNAL, 2019

76

Rheological and electrical properties of polystyrene nanocomposites via incorporation of polymer-wrapped carbon nanotubes
장건수, Park, JS (Park, Jae Sang), An, JH (An, Ji Hun), Lee, SJ (Lee, Seong Jae)
KOREA-AUSTRALIA RHEOLOGY JOURNAL, 2019

77

Electrically conductive polystyrene nanocomposites incorporated with aspect ratio-controlled silver nanowires
장건수, Kim, JM (Kim, Jung Mock), 이성재
JOURNAL OF APPLIED POLYMER SCIENCE, 2019

78

Theoretical analysis and development of thermally conductive polymer composites
장건수, Kim, SJ (Kim, Sung Jun), Hong, CM (Hong, Changmin)
POLYMER, 2019

79

Probing toughness of polycarbonate (PC: ductile and brittle)/polypropylene (PP) blends and talc-triggered PC/PP brittle composites with diverse impact fracture parameters
장건수
JOURNAL OF APPLIED POLYMER SCIENCE, 2019

80

Compatibilizing effects for semicrystalline polymer-infiltrated amorphous polymer matrix: Mechanical (toughness), thermal, and morphological behavior of compatibilized polypropylene/polycarbonate blends
장건수
JOURNAL OF APPLIED POLYMER SCIENCE, 2019