Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
YS Eom, KS Jang, JH Son, HC Bae, KS Choi
TRI Journal, 2019
82
Electrically conductive polystyrene nanocomposites incorporated with aspect ratio‐controlled silver nanowires
JM Kim, KS Jang, SJ Lee
Journal of Applied Polymer Science, 2019
83
Theoretical analysis and development of thermally conductive polymer composites
SJ Kim, C Hong, KS Jang
Polymer, 2019
84
Adhesive film for electric device and method of fabricating semiconductor package using the same
J Keonsoo, YS Eom, KS Choi, SH Moon, HC Bae
US Patent App., 2019
85
Compatibilizing effects for semicrystalline polymer‐infiltrated amorphous polymer matrix: Compatibilizing effects for semicrystalline polymer-infiltrated amorphous polymer matrix: Mechanical (toughness), thermal, and morphological behavior of compatibilized polypropylene/polycarbonate blends
KS Jang
Journal of Applied Polymer Science, 2019
86
Collective laser‐assisted bonding process for 3D TSV integration with NCP
W Alves Braganca, YS Eom, KS Jang, SH Moon, HC Bae, KS Choi
Etri Journal, 2019
87
Rheological and electrical properties of polystyrene nanocomposites via incorporation of polymer-wrapped carbon nanotubes
JS Park, JH An, KS Jang, SJ Lee
Korea-Australia Rheology Journal, 2019
88
Probing toughness of polycarbonate (PC: ductile and brittle)/polypropylene (PP) blends and talc‐triggered PC/PP brittle composites with diverse impact fracture parameters
KS Jang
Journal of Applied Polymer Science, 2019
89
Exploring polyethylene/polypropylene nonwoven fabrics derived from two-dimensionally co-extruded composites: Effects of delamination, consolidation, drawing and nanoparticle incorporation on mechanics, pore size and permeability
KS Jang
Composites Science and Technology, 2018
90
Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis