발행물
컨퍼런스
The 23th Korean Conference on Semiconductors (KCS 2016)
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Transfer Characteristics of Vacuum Channel FETs with Tip Positions of Emitter and Collector
Fabrication and Bias-Temperature Instability of Vertical Low-Temperature Poly-Si Thin-Film Transistor
Reliability Characteristics in Junctionless Poly-Si Thin-Film Transistors
Investigation of stress-induced instability of SiC DMOSFETs
2016년도 한국반도체디스플레이기술학회 (2016 SSD)
Void-free bottom-up electroplating for fabrication of through-silicon via,